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IS200EGPAG1BCA Mark VIe Control System
IS200EGPAG1BCA Product Introduction
Basic Information
Brand: GE (General Electric)
Model:IS200EGPAG1BCA
Part Number: IS200EGPAG1BCA
Series: Mark VIe Speedtronic Turbine Control System I/O Pack
Country of Origin: United States
Product Type: Discrete Input Module (Contact Input Module), also known as PDIA I/O Pack
contacts： Mike
+86 18350224834 （WeChat/WhatsApp）
Email：Mike18350224834@gmail.com
Functional OverviewThe IS200EGPAG1BCA is a 24-channel discrete (digital) input module in the GE Mark VIe control system. Its primary function is to collect discrete signals (contact open/close signals) generated by field devices such as sensors,
switches, and relays, convert them into digital signals that can be recognized and processed by the PLC or control system CPU,
and transmit the processed data to the GE Speedtronic turbine control system or other control equipment, enabling automated control and monitoring. Key Technical Specifications
Rated Voltage: 24.0 VDC (Nominal)
Maximum Rated Voltage: 28.6 VDC
Maximum Rated Contact Input Voltage: 32 VDC
Number of Input Channels: 24 Discrete Inputs
Operating Temperature Range: -30°C to +65°C
Environmental Adaptability: Passes rigorous environmental testing, capable of long-term stable operation in harsh industrial environments Compatible Terminal Boards
The IS200EGPAG1BCA can be paired with a variety of GE terminal boards, including but not limited to:
IS200STCIH1A / IS200STCIH2A
IS200STCIH8A
IS200TBCIH2C / IS200TBCIH4C
IS400STCIH1A / IS400STCIH2A / IS400STCIH8A
IS400TBCIH2C Certifications and Safety
This module is UL certified and can be used in both hazardous and non-hazardous locations. The UL certification covers various classes and divisions, and relevant UL mark documents are available for reference.
Activities in the automotive electronics sector will include: SAE-AWC 2021 Automotive Electronics Innovation Technology Forum, “Smart Car ‘Hundred Forum’ Issue 21 – China Automotive Semiconductor Technology Summit Forum”, AWC 2021 Third Automotive Digital Cockpit Forum wait. At the same time, the China Intelligent Connected Vehicle Industry Summit will invite speakers from well-known industry companies, research institutions, universities and other industries with advanced technological advantages in the field of intelligent connected vehicles and new energy vehicles to share their experience in the design, development and production of intelligent connected vehicles. Problem solving and innovative technology; in future smart transportation, the relationship between cars, software, data, environment, and ecology, and how car companies and suppliers can better work together to create future value.
The activities in the intelligent manufacturing and terminal application section are more abundant, including: Global Intelligent Manufacturing Academy, NEPCON World Hardware Electronics Innovation Conference, ” NEPCON and Smart Factory 1.0 – The Future of Electronic Manufacturing” themed seminar, Internet of Things Innovation Technology and Application Conference, SiP Micro-assembly industry breakthrough and innovation summit forum and 5G mobile phone intelligent manufacturing industry chain summit, etc.
Activities in the electronic components and materials section will include, 2021 Domestic Semiconductor Industry High-end Summit, Innovation and Opportunities, Empowering Domestic Brands – 2021 Bay Area China Piezoelectric Crystal Information Technology Forum, “Focus on Internet of Things Technology, Insights into Cutting-edge Applications” Summit Forum, seminar on the road ahead under core shortage, component trading forum, etc.
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